Soft Thermal Pad K=3.0

Model:XK-P30
Thermal Conductivity:3.0 W/(m·K)
Features:

High insulation and compressibility,ultra conformable under low pressure,good deformation for large institutional design tolerance

Applications:

High-end industrial and medical electronics, and mobile communications equipment, high-speed mass storage drives and other high efficiency heating equipment

PDF Specification:Download
Hotline:+86-755-27579310


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