Silicone Thermal Pad K=1.2

Model:XK-P12
Thermal Conductivity:1.2 W/(m·K)
Features:

Ultra conformable,“gel-like” modulus, designed for low-stress applications, low hardness

Applications:

High-end industrial and medical electronics, and mobile communications equipment, high-speed mass storage drives and other high efficiency heating equipment

PDF Specification:Download
Hotline:+86-755-27579310


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