Soft high thermal silica film K 6.0

Model:
Thermal Conductivity:6.0 W/(m·K)
Features:

Ultra-high ceramic filler amount (non-metal) gaskets, high thermal conductivity, high insulation, high withstand voltage, low permeability, high reliability, high compression and resilience, self-adhesive soft and easy construction

Applications:
PDF Specification:Download
Hotline:+86-755-27579310


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