Soft Thermal Pad K=4.5

Model:XK-P45
Thermal Conductivity:4.5 W/(m·K)
Features:

Ultra-soft, “gel-like”modulus, designed for low-stress applications, low hardness, high compressibility, easy to assemble

Applications:

Telecommunications, Computer, Between heat-generating semiconductor and a heat sink

PDF Specification:Download
Hotline:+86-755-27579310


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