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HOME > Non-Silicone > Non-Silicone Thermal Pad
Non-Silicone Thermal Pad
 
 
Non silicone thermal pad K=5.0
Datasheets
Features

No siloxane volatiles

High thermal performance

Exellent compressibility

Low hardness, conformable

Electrical insulation

 

 

Applications

Optical precision devices

Telecommunication

Industrial and medical electronics

Automotive ECU

 

Description

XK-PN50 is a soft and compliant thermal gap filler pad with thermal conductivity of 5.0W/mK. It offers exceptional thermal performance at low pressure due to low-modulus formulation. Designed  for silicone-sensitive applications, offering high electrical insulation and excellent thermally conductive.

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