Dispensable Thermal Pad K=3.0

Model:XK-S30LV
Thermal Conductivity:3.0 W/(m·K)
Features:

High performance, 1:1mix, 100%-no cure by-product, untra conformable, low stress application, easy to assemble, fast cure by heating

Applications:

Automotive electronics, telecommunications, precision motors, computer and peripherals, between any heat generating semiconductor and a heat sink

PDF Specification:Download
Hotline:+86-755-27579310


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