Stressless thermal Gel K=7.9

Model:XK-G80
Thermal Conductivity:7.9 W/(m·K)
Features:

High deformation, designed for UAV, excellent compressibility, low thermal resistance, good creep performance, best for north bridge IC, syringe package for automated assembly

Applications:

Consumer electronics, Automotive Systems.

Telecomunications, Hand-set applications


PDF Specification:Download
Hotline:+86-755-27579310


Send Inquiry