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Non-Silicone Thermal Gel
 
Non-silicone Thermal Gel K=3.0
Features

High thermal performance

Low thermal resistance

Ultra conforming

Low stress, non pump-out

 

 

Applications

Automotive electronics

Comsumer electronics

Telecommunications

LED

Description

XK-GN30 is a non-curing, non-silicone based, high performance and low thermal impedance thermal putty gel. It has a high reliability, and never dry out even in severe environment application(-30℃). The wet-out feature will reduce contact thermal resistance and optimize thermal transfer.

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