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Thermal Gel, 5G Thermal Putty, GLPOLY Thermal Interface Materials
Non-Silicone
Silicone Base
Thermal Gel K=3.2
This thermal gel is designed for high performance applications requiring rapid heat transfer, providing low thermal resistance and ultra thin bondline....
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Thermal Gel K=8.0
High performance thermal gel provides low stress for fragile components, high thermal conductivity of 7.9W/mK, high conformable under low forces....
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Thermal Gel K=6.0
XK-G60 is a high performance, low thermal impedance thermal gel with thermal conductivity of 6.5W/mK. It is suitable for automated system reducing cost....
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Thermal Gel K=5.0
Thermal gel XK-G50 provides high performance, low thermal resistance at thin bondline thickness of 0.1mm. Filling voids and gaps at low compressive forces....
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Thermal Gel K=4.0
thermal paste XK-G40 is designed for automated dispensing to reduce time consuming hand assembly, save cost and improve productivity....
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Thermal gel k=2.0
XK-G20 is a dispensable, high thermal performance, one-part thermal gel. It is designed to eliminate hand assembly ...
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Thermal Gel K=1.5
XK-G15 provides low thermal impedance and ultra thin bondline thickness, improving heat transfer. It is d...
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