High thermal performance

Low thermal resistance

Ultra thin bondline

Conforming with wet out

Design for low stress application

Automotive electronics

Comsumer electronics

Telecommunications

Computer and peripherals

XK-G15 provides low thermal impedance and ultra thin bondline thickness, improving heat transfer. It is designed to eliminate hand assembly time consuming, decreasing installation cost, it requires no curing and accommodates a variety of bondline thickness, providing superior design flexibility.