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HOME > Non-Silicone > Non-Silicone Thermal Compound
Non-Silicone Thermal Compound
 
 
Silicone free thermal compond K=0.8
Datasheets
Features

Epoxy resin based

Strong structural bond

Excellent mechanical and

chemical stability

Fast cure with additional heat

Applications

Automotive electronics

Telecommunications

Motor

Description

XK-SN10 is a two part thermal compound with high bond strength, it is supplied in two-part, suitable for automated dispensing. It can cure at room temperature, or can be accelerated with additional heat. It is ideal for motor thermal transfer.

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