Laird Tflex700 is a high performance thermal gap pad, it is highly applied in electronics thermal management. To many small-scale enterprise, it takes a long time to expect goods, because the lead time and MOQ.

Many customer want to find a substitute for Laird Tflex700, GLPOLY XK-P50 would be a good choice. Lte’s compare GLPOLY XK-P50 with Laird Tflex 700. Thermal conductivity of these two materials are 5.0W/mK, this is a significant data but it’s not the unique judgment criteria. Thermal impedance is key data for evaluating thermal performance. Laird Tflex 700’s thermal impedance is 0.4°Cin2/W, comparing to most of similar products, it’s good enough, but GLPOLY XK-P50’s  thermal impedance is half of that of Laird Tflex700. By evaluating thermal conductivity and thermal impedance, GLPOLY XK-P50 provides a better thermal performance.

Hardness is very important for assembly too, if thermal pad is too hard, strain may break PCB. Considering assembling pressure and strain, GLPOLY desgins XK-P50 thermal gap pad with Shore00 45 hardness, filling small gaps and improving effective contact. It’s suitable for many presice applications such as auto electronics, industrial computer, telecommunications and more. Tflex700 is a little harder than XK-P50, we can not judge which is better by this, but XK-P50 provides better compression, vibration dampening and low contact thermal resistance.

By contrast, GLPOLY XK-P50 provides excellent thermal performance, as good as  Laird Tflex700 at least.