GLPOLY XK-G60 is a high performance, one component, dispensable thermal compound developed to conduct heat between a hot component and a heat sink or enclosure. The XK-G60 thermal gel provides low thermal impedance at multiple gaps to allow the use of common heat spreaders.

The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. XK-G60 thermal gel requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses.

This one component material is formulated to accommodate today’s high performance electronics and is ideal for automated dispensing machines, rework and field repair situations.

Compared to Chomerics THERM-A-GEL 60(thermal conductivity is 6.0W/mK), XK-G60 thermal gel provides more excellent performance. Thermal conductivity is 6.5W/mK, it is higher than Chomerics THERM-A-GEL 60's, making heat transfer rapidly.

GLPOLY XK-G60 thermal gel is a single-component thermal gel, fully cured, dispensable putty with 6.5 W/m-K Thermal Conductivity. it is suitable for automated dispensable system, improving productivity and saving cost. also it reduces manufacturing, purchasing and logistics complexity. it requires no mixing or curing, providing superior design flexibililty.