GLPOLY THERMAL GAP FILLER XK-S40, Thermally Conductive, Two-part, Liquid, Gap Filling Material

GLPOLY THERMAL GAP FILLER XK-S40 is an excellent material in thermally conductive, liquid gap filling materials, featuring ultra-high thermal performance and superior softness.  GLPOLY THERMAL GAP FILLER XK-S40 is a two-component liquid gap filling material, cured at either room or elevated temperature. Compared with Bergquist Gap Filler TGF 3600, GLPOLY THERMAL GAP FILLER XK-S40 provides a higher thermal conductivity of 4.0W/mK.

For electrical propertier, GLPOLY THERMAL GAP FILLER XK-S40 has excellent electrical insulation, the volime resistivity is 1x10¹²Ωcm,  it offers higher reliability than Bergquist Gap Filler TGF 3600.

Prior to curing, the material maintains good thixotropic characteristics as well as low viscosity. The result is a gel-like liquid material designed to fill air gaps and voids yet flow when acted upon by an external force (e.g. dispensing or assembly process). The material is an excellent solution for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing. Once cured, it remains a low modulus elastomer designed to assist in relieving CTE stresses during thermal cycling yet maintain enough modulus to prevent pump-out from the interface.

GLPOLY THERMAL GAP FILLER XK-S40 will lightly adhere to surfaces for reducing thermal resistance, thus improving surface area contact. GLPOLY THERMAL GAP FILLER XK-S40 is not designed to be a structural adhesive.

GLPOLY THERMAL GAP FILLER XK-S40 is suitable for automated dispensing system, eliminating hand assemly time comsuming, decreasing installation cost and improving productivity and providing superior design flexibility.