Thermal gel,thermal gap filler,thermal putty

GLPOLY XK-G50 is a high performance, dispensable thermal gel designed to transfer heat between a heat source and a heat sink. GLPOLY THERMAL GEL XK-G50 features high thermal conductivity of 5.0W/mK, allowing for transferring heat rapidly.

GLPOLY THERMAL GEL XK-G50 is functionally equivalent to Chomerics THERM-A-GAP TC 50. Both of them provide 5.0W/mK of thermal conductivity, ultra thin bondline thickness and low thermal resistance at multiple gaps to allow the use of common heat spreader. The material paste-like consistency enables controlled dispensing, applied in variable thickness to suit application needs. You can find they provide same functions and effect, considering THERMAL GEL XK-G50 an alternative to Chomerics THERM-A-GAP TC50.

THERMAL GEL TC50 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses.

GLPOLY THERMAL GEL XK-G50 is suitable for automated dispensing system for improving productivity and saving cost. The dose and dipensing path are programmable and controllable.

Thermal gel is differ from thermal grease, it never run like grease, no pump out, no contamination. It is ideal for rework and field repair situations, you can clean it up with a piece of fabric and dispense again, the product is ready  to ship.

GLPOLY THERMAL GEL XK-G50 requires no curing or mixing, providing superior design flexibility.

XK-G50 THERMAL GEL is formulated to accommodate taody’s high power or high performance electronics with proven ability and reliability, keep your devices performing at their best.