THERMAL GAP PAD, THERMAL GAP FILLER, THERMAL MANAGEMENT

GLPOLY XK-J25 is a high performance hybrid thermal management and EMI absorber material. This product is used like a traditional thermal gap pad between a heat source and a heat sink or other heat transfer device or chassis.

What’s the difference between GLPOLY Hybrid thermal and EMI material XK-J25 and Laird coolzord 500? Let’s check it out.

GLPOLY Hybrid thermal and EMI material XK-J25 provides 2.5W/mK of thermal conductivity and a low thermal resistance by 0.48℃in2/W. There is inherent surface tack on both sides, it makes assemling easier. Furthermore, the self tack will reduce thermal resistance, and optimize thermal transferring.

GLPOLY Hybrid thermal and EMI material XK-J25 has a low hardness with a value of Shore00 55. It is softer than many tranditional thermal gap pad, conforming to component topography.

In the past, we need to use two kind of materials to solve thermal and EMI problem, but now, Hybrid thermal and EMI material XK-J25 has two functions, thermal conductivity and Electromagnetic absorber, allowing for solving both issues at the same time in the limited space. It brings customer more value except thermal transfer and EMI reduction, the improved reliability performance of electronics

1)better signal integrity due to reduction of EMI,

2)consistent performance of electronics due to temperature stability and low outgassing property of product.

GLPOLY Hybrid thermal and EMI material XK-J25 offers a cost effective thermal management solution for your 5G devices, it save you space making you equipment work at their