TEL:86-755-27579310
GLPOLY Thermal Management
Committed to solving thermally conductive
problems for top-class clients
 
Blog
Blog

GLPOLY Thermally conductive adhesive XK-D25H vs Bergquist Liqui-Bond EA1805

2019-12-31 17:35:31   |   Source:GLPOLY   |   Author:GLPOLY   |   Views:

THERMALLY CONDUCTIVE ADHESIVE,THERMAL GAP FILLER,THERMAL MANAGEMENT


It becomes a trend that thermally conductive adhesives will be applied in electrical vehicle battery pack instead of encapsulant.

What kind of material is thermally conductive adhesive? GLPOLY thermally conductive adhesive XK-D25H is two-component, epoxy based, dispensable adhesive. It has a thermal conductivity of 2.5W/mK.

XK-D25H thermally conductive adhesive (thermal gap filler) has a high bond strength with room temperature cure. The strong bonding eliminates the need for mechanical fasteners and maintains structual bond of 3.7MPa in severe environments.

It is supplied in two-component format, mix ratio 1:1 by volume and suitable for automated dispensing equipments, improving productivity and saving cost.

Bergquist Liqui-Bond EA1085 is the most famous one, let’s check it out what material it contains and how about the thermal performance is.

Bergquist Liqui-Bond EA1085 is a epoxy based, dispensable adhesive, it has a thermal conductivity of 1.8W/mK, it provides a lower performance than GLPOLY XK-D25H thermally conductive adhesive. Absolutely, GLPOLY XK-D25H can substitute for Bergquist Liqui-Bond EA1805.

GLPOLY XK-D25H will deflect easily under very low compressive forces resulting  in thin bondliness and very low stress applied on fragile components. It is recommended for filling irregular surface.

XK-D25H thermally conductive adhesive provides high thermal performance, strong bonding and vibration dampening, it is ideal for thermal management of electrical vehicle battery pack.

 

 
Man's Lab: