THERMAL GEL, THERMAL GAP FILLER, THERMAL PAD, THERMAL MANAGEMENT SOLUTION

Many customers designed a thermal pad solution to DDR chip before, now I recommend a thermal gel for your DDR chip thermal management.

Last month, one customer left me a message,it said” we need some thermal pads in size of 25x25x1.5/2.0mm for test, there are several chips need to be cooled dowm, the height difference is 1mm, it's better to use one thermal pad filling the gap”.

As there is a  height difference between the chips, I think a material with high compression ratio is needed, so I recommended thermal gel XK-G40. Why don’t I recommend thermal pad? I’m not saying using thermal pad is wrong, but it should  fit the height difference of chips and provide excellent compression ratio. Itmeans that the thermal pad must be extremly soft, thermal pad are not the best choice. High performance thermal pad has a high hardness, it provides high stress, maybe causing component failure.

XK-G40 is a dispensable, high performance thermal gel. It deflects under low compressive forces eliminating possibility of damaging chips. XK-G40 thermal gel is suitable for automated dispensing system decreasing hand assembly time consuming and installation cost, reducing purchase, managmenet complexity.

Customer reviewed the desgin and wished to test thermal gel after they understood the advantages of thermal gel, we delivered the samples in 3 days.

One month later, customer came back to us and said”thermal gel is pefect for irregular surfaces, high performance, low compressive forces and low stress, we don’t need to warry about damaging component”.

XK-G40 thermal gel has been applied in DJI drone by high relibility and long service life. It requires no curing or mixing, providing design flexibility. XK-G40 thermal gel help you design breakthroughs.