We used to apply thermal gap pad in thermal management, sometimes, there would be some problems. If a certain amount of compression is required, the compressive force may destroy the chip. How can we fix this problem? Here is a example for your reference.

A medical equipment manufacturer consulted with us about thermal management solution. they used a thermal gap pad with a thermal conductivity of 3.6W/mK, the performance is good enough when they tested the thermal pad, but heat dissipating is not good as expected. The supplier told them the interface contact is not tight enough, and requested customer to place much more compressive forces. Finally, this resulted in destroy to chip.

As we learned about this application, we knew the strain was what mattered. GLPOLY had designed a sort of thermal gel to fix problem like this. We recommended XK-G40 high performance thermal gel with a thermal conductivity of 4.0W/mK which was verified by the third party to customer. This material defects under low compressive force, decreasing stress on component thus decreasing components failure.

GLPOLY XK-G40 is high performance, thermally conductive, liquid gap filling material designed to eliminate time consuming hand assembly, decreasing installation costs and reducing customer purchasing complexity. This thermal paste is one-component packaged, suitable for automated dispensing system, improving productivity.

GLPOLY thermal management materials had been applied to military equipment, automotive electroncis and EV battery pack and ECU. GLPOLY helps keep your devices performing stable with complete portfolio of thermal interface materials including thermal gap, thermal gap filler, thermal paste and silicone-free thermal materials.