Some customers gave us a master data sheet from other suppliers for comparing  when they wanted to select a thermal gap pad from GLPOLY, all requirements should be similar. For example, the original data sheet marked”fiberglass or PI reinforced”, they need a fiberglass reinforced material too, even they don’t know what function or effect it acts.

Firstly, the reinforcement of fiberglass or PI will make thermal resistance higher. Both of them will not act as thermal interface materials, reducing thermal performance.

Secondly, cost rise. If you need a same thermal conductivity after fiberglass or PI reinforced, we need to use a higher performance thermal management material, costs will rise by 30%. At the meantime, the cost of process will be inceased too, because it’s more sophisticated. Also don’t forget the cost of fiberglass or PI.

Last week, one customer consulted with me about thermal interface materials and ask if we can make a thermal gap pad respecting his requirements. Actually, it just was a regular product, 2.0W/mK of thermal conductivity, Shore00 50 hardness, 4.0mm thickness, one sided fiberglass reinforced. I asked the cutomer why he request fiberglass reinforcement because it affects heat transfer greatly.

The custmer get this data sheet from another supplier, said “it increases tear resistance for easy assembly”. I understand customer’s concerns, but according to our experience, a thermal silicone pad with Shore00 50 hardness and 4.0mm thickness provides enough tensile strength and tear resistance for assembly. Finally, we sent samples without reinforcement to customer, and test went well.

We will recommend a better thermal management solution for you and keeping your devices performing stable.