Filling gaps between heat source and heat sink

Excellent electrical insulation, bond strength≥13 Mpa

Application temperature: -45~175℃, Short  term: 250℃

Aerospace equipments

Semiconductor

Telecommunication

Rail transit

Battery pack

between water cooling plate and heat source

XK-D10 is a two-part, modified epoxy based, liquid dispensable, thermally conductive adhesive with a thermal conductivity of 1.0W/mK. This material features high performance, electrical insulation, structural bonding and seal. XK-D10 provides strong bonding with room temperature cure and can be accelerated with elevated temperature. The high bonding strength eliminates the need of fasteners and maintains structural bond in severe environments.