Thermal siliocne grease was the main thermal solution for CPU in last several decades, high performance, low thermal resistance, ultrathin bondline thikcness are the oustanding features which outperforms common thermal pads.

But now more and more thermal managment engineers do not like to utilize thermal silicone grease in their applications. Why does such a high performance thermal interface material be abandoned?

There are several reasons. Firstly, the thermal silicone grease will be pumped out and drip off when we apply some pressure, Secondly, it drys out and volatilizes in high temperature conditions, volatiles will affect performance and service life of products. Thirdly, when we want to replace it with new material, it’s not easy to clean up because lots of silicone oil.

What kind of thermal interface material can be an alternative to thermal silicone grease? GLPOLY had desgined a thermal gel that provide excellent performance and avoid faults above mentioned. For example, GLPOLY thermal gel XK-G30, It is a new solution for thermal management, syringe packed, suitable for automated production system. thermal gel can be infinitely compressed, the thinnest bondline thickness is 0.09mm, thermal resistance is 0.00012℃in²/W, the most important is that thermal gel never dry out and drip off, it is ideal for delicate conponents with low stress.

Thermal gel XK-G30 deflects under low compressive forces, decreasing stress on complures.it is ideal for dedicate components and powerful equipment.

GLPOLY high performance thermal gel has been provided for DJI drone in volume production for several years and no quality complaint raised.

GLPOLY thermal management materials provide you with superior design flexibility and help you design breakthroughs.