One of our customer desgined thermal solution for electronics control unit, there are two options, one is thermal gap pad and one is thermal gel. The thermal management engineer prefers a 8.0W/mK thermal pad, because its thermal conductivity is much higher than that of silicone free thermal gel.

The gap is 0.1mm between heat source and heat sink in customer’s application, so we suggested having a try on thermal putty gel XK-G50. After customer went through the data sheet, he didn’t want to use this material. Why? The customer explained that the thermal conductivity of 5.0W/mK is much lower than he expected, the one with a thermal conductivity of 8.0W/mK would be the right one.

We showed thermal management engineer the comparison data between XK-G50 thermal gel and thermal silicone pad. Thermal conductivity of thermal silicone pad is 8.0W/mK, thermal impedance is 0.13℃in2/W, even though thermal conductivity of thermal silicone putty is 5.0W/mK only, the thermal impedance is just 0.001℃in2/W, we can see that thermal performance of thermal putty gel is much more excellent than that of thermal gap pad. While thermal conductivity is a very important factor, but it’s not the only one that should be taken account when judging thermal performance.

In addition, the gap is only 0.1mm, it’s very hard to make such a thin thermal pad, but silicone free thermal gel can finish this job easily. GLPOLY XK-G50 thermal paste will defelct under low compressive forces, dcreasing stress on components and improving thermal contact.

Customer considered our suggestion carefully and decided to test thermal gel first. One week later, the engineer told us”we don’t need to test thermal pad, thermal gel is exactly what we want, it makes tempearture rise down by 30 degree”. Now this project has been approved, production will be proceed at the end of this year.

GLPOLY help you protect your brand reputation with complete portfolio of thermal management materials and superior service.