It is reported that the power consumption of 5G is four times than that of 4G,. A large amount of heat will be generated by powerful semiconductor, how do we select thermal interface materials to solve thermal management problems?

A thermal gel with thermal conductivity of 3.0W/mK is enough for telecommunications such as base station, mobile phone, computer and power supply in the last years, GLPOLY XK-G30 can be used for solving thermal management  problems for above devices.

But now, 5G/6G has come, we must develop better performance thermal interface materials to accommodate powerful devices. GLPOLY launched 6.5W/mK and 8.0W/mK thermal gel and 11.0W/mK thermal gap pad, maybe other manufacturers could tell you that they produced higher performance thermal gap pad, such as 13.0W/mK, 15W/mK, whatever. Comparing with thermal gap pad, GLPOLY thermal gel provides much better thermal performance even if it has a lower thermal conductivity than thermal gap pad. Why?

Let’s check it out. Firstly, the thermal resistance of thermal gel is extremely low, 0.001℃in^2/W, maybe one tenth thermal resistance of a thermal gap pad. thermal gel would wet-out interface, optimizing thermal contact and decreasing contact thermal ressitance; Secondly, the bondline thickness could be 0.1mm, making heat transferring rapidly. Thirdly, thermal gel is ultra conformable, it will deflect under low compressive forces, expelling air and filling gaps.

Furthermore, thermal gel is syringe packaged and designed for automated production dispense process, eliminating time consuming hand assembly, reducing purchase and logistics complexity. It requires no curing, providing superior design flexibility.

GLPOLY has partnered with dJI, Han’s SMC and Freetech etc top brands, providing exceptional performance and high reliability thermal interface materials.