To satisfy the thermal management demands of today’s electronic devices, GLPOLY had developed a complete portfolio of high performance thermal interface materials. Effectively control of heat is an increasing concern among today’s electronic device designer and manufacturer, as each new electronic product  generation  requires higher power or performance in smaller packages. The challenges associated with thermal management become more intense.

GLPOLY has developed special thermal interface materials for individual device, such as XK-GN30 non-silicone thermal gel, it was designed for applications which requires no siloxane volatiles, no silicone oil leakage. For example, one of our customers requested a thermal interface material for security camera. The thickness of material should be 0.1mm and thermal conductivity could be 2W/mK or 3.0W/mK, the customer wanted to test some thermal gap pad and thermally conductive insulator samples.

Actually for such a thin interface, we don’t recommend a thermal gap pad because these thermal pads were used for large tolerance. Liquid materials would be a good choice. Firstly, liquid materials provide ultra thin interface thickness, secondly, liquid thermal interface materials provided lower thermal resistance than thermal pads. Furthermore, this is optical lens in application. if we use traditional thermal silicone grease or silicone gel,  there will be siloxane volatiles attaching on the optical lens, making lens atomized and affecting definition of images.

Based on the mentioned factors, we recommended non silicone thermal gel XK-GN30. It is a high performance, low thermal resistance thermal gel, designed for automated dispensing system and to eliminate time consuming hand assembly. GLPOLY XK-GN30 has been successfully used to fill a variety of different gap thickness. The soft gel is ideal for fragile components with ultra low compression force and requires no mixing or curing, providing superior design flexibility.

GLPOLY non-silicone thermal gel is designed to eliminate time consuming hand assembly, decreasing logistics complexity. It is compatible with automated production dispense process and accomoates different gap thickness.