Lots of experients prove that thermal gel provides a much more excellent thermal performance than thermal gap pad does. More and more engineers design thermal gel solution for their applications. GLPOLY had launched a series of thermal gels to solve thermal management problem.

What kind of thermal interface materials would it be? How about the performance would it provide? Let me give you a case of comparison between GLPOLY XK-G50 and Fujipoly SPG50A.

Fujipoly SPG50A was a thermally conductive, dispensable thermal gel that recognized by customers for high performance and reliability. It had a thermal conductivity of 5.0W/mK and low thermal resistance, outperforming most of similar products. Benchmarking this material, GLPOLY had launched 5.0W/mK thermal gel XK-G50, providing equivalent performance to Fujipoly SPG50A.

Two years ago, a French customer asked for a alternative to Fujipoly SPG50A, he said he had tested several samples, no one could achieve his requirements. We were confident about the characteristics of thermal gel XK-G50, we sent samples to customer for verifying on site. Test lasted for two months for 1000 cycles of thermal shock, GLPOLY XK-G50 thermal gel exhibited excellent reliability, data changes was less than 5%. It was a perfect alternative to Fujipoly SPG50A.

GLPOLY XK-G50 thermal gel is a high performance, low thermal resistance thermal gel with a thermal conductivity of 5.0W/mK. It deflects under low compressive forces, decreasing stress on component. XK-G50 thermal gel is compatible with volume, automated production dispense process.

GLPOLY thermal gel XK-G50 has been applying to some top brands such as dJI drone, DT mobile and Freetech auto pilot etc., providing high perofrmance thermal gel for them with proven reliability.

GLPOLY thermal interface materials, strives to be top class.