GLPOLY Non-silicone thermal pad is designed to benchmark FJ NR-c non-silicone thermal pad. With the features of no silicone oil leakage, no siloxane volatiles, no pollution to product and high reliability, it will become more and more popular in electronic thermal management.

Here we take Fujipoly NR-c as a example and make a comparison between GLPOLY non-silicone thermal pad and Fujipoly NR-c thermal pad, showing what advantages GLPOLY non-silicone thermal pad provides:

GLPOLY non-silicone thermal gap filler pad has low hardness than Fujipoly NR-c, it offers a higher thermal conductivity and better conformability, keeping the thermal gap filler pad close contact with heat sink.

Aimed at the trend of lightweight, GLPOLY designs thermal gap pad in a low density, it is lower than FJ NR-c.

GLPOLY silicone-free thermal gap filler pad provides excellent electrical properties also, the dielectric voltage is up to 10KV, offering good reliability to products.

Comparison data shows that there are no distinctive technique differences between GLPOLY thermal gap filler pad and  FJ NR-c. GLPOLY thermal gap filler pad can perfectly replace Fujipoly NR-c thermal gap pad.

GLPOLY has run into industry of thermal interface materials for more than 12 years, it is committed to delivering advanced technological service to customer, help protect their brand reputation for performance and reliability.