GLPOLY The thermal gel XK-G60 is a high performance thermal management solution for electronics assembly, combining thermally conductive particle and silicone gel to provide high conformability and thermally conductive properties, as excellent as Chomerics THERM-A-GEL 60.

XK-G60 is formulated to accommodate today’s high performance electronics requirements and designed to transfer a high degree of heat away from hot components to heat sink.

It is a fully cured, no pump out, auto dispensable thermal interface material designed to replace conventional thermal conductive gap filler or pad. Simply dispense thermal gel onto component, assemble heat sink over it, and the product is ready to go. It is ideal for rework and maintainment situation.

This thermal gel does not require mixing and cure cycle, auto-dispensing process can reduce the assembly time and cost, which make the design more flexible. Chomerics THERM-A-GEL 60 is not the only choice to you.

With ultra soft properties, this thermal gel can easily deflect under very low compression force and will fill voids and uneven surfaces, accommodating a variety of bond line thickness. Thermal gel XK-G60 will also wet out matting surfaces in order to efficiently transfer heat from components to the heat sink.

Thermal gel XK-G60 can be stored at room temperature without any filler settling issues and is supplied in one-part, it is alternative toChomerics THERM-A-GEL 60.

GLPOLY thermal gel XK-G60 features,

Easily dispensable

No pump out, no drip off

Low thermal impedance

Ultra low compressive forces

Long-term reliability

GLPOLY thermal interface materials had been used in military equipment in 2019 National Day Parade. Also we are supplying therma gel to DJI, applying in drone. GLPOLY thermal interface materials provides remarkable quality, keeping your device cool and performing at their best.