GLPOLY provides two super-star thermal interface materials for EV battery pack thermal management: Thermally Conductive Structural Adhesive XK-D20 & Thermal Gap Filler XK-S20, both commissionning 20 performance tests by third party, and reliability test for1000 hours accelerated aging.
Only a few of the domestic factory can handle the mass production of the 1: 1 two-component liquid thermal conductivity material, meanwhile have the production capacity to meet the requirements from the automobile plant or battery module manufacturing enterprise. GLPOLY has got several automotive projects from the beginning of the 2019, 3 of these projects already passed the test and verified by the third party, others are in the sample testing stage.
It is always taken a long time to confirm and match the automotive spec, however, we could say that thermal conductivity of 2.0 ~ 2.5 w/m · k become the conventional coefficient for the heat conductive design of power batteries.
Better to know more about these two materials, we made the following analysis:
Three Advantages of Thermal Conductive Structural Adhesive and Thermal Gap Filler
1. Maximum Advantage: Cost Savings
▪ 100% utilization, no waste discharge, and more optimized usage
▪ No die cutting cost and die cost
▪ No worry about die cutting capacity and delivery time
▪ Reduce inventory costs
▪ Reduce logistics costs
▪ Reduce management costs
▪ Suitable for fully automated dispensing (production without lighting)
2. Automatic Production Oriented: Fast Programming
▪ Satisfy different dispensing paths
▪ Using the same liquid thermal interface materials, satisfy multiple sizes or thicknesses.
▪ There is no need to add multiple TIM parts to the BOM. Reduce related logistics, management and inventory costs.
▪ If there is a design revision change, there is no wrong inventory and no cost of any updating tools or molds.
▪ The programming parameters can be changed immediately and the lead time for revising updates can be reduced.
※ TIM：Thermal interface material
3. Better thermal performance: maximum filling
▪ Wetting of adjacent surfaces of the liquid material reduces thermal resistance
▪ Maximum filling gap, absorbing assembly tolerance. Automatic dispensing with assembling, no overflow when the material is cured.
Two difference between Thermal ly Conductive Adhesives and Thermal gap filler.
Instead of the gap pad, the application of liquid materials has brought many challenges: Purchase and install dispensing equipment, training corresponding operators, equipment maintenance, etc. Both of this materials can cure, and how to select them can be evaluated from their differences.
1. Raw material differences: Advantages of material characteristics
▪ Hardness: XK-S series is gap filler, which has certain softness after curing, and buffering effect on metal structure. XK-D series is a non-silicone thermal gap filler, which its hardness as a coin. It is suitable for the integrated design of adhesion, thermal conduction and sealing.
▪ Service temperature:XK-S series can be-50 ~ 200 ℃; The XK-D series can be used at-50-145 ℃
▪ Adhesion strength: XK-S series is filled in gaps, maintaining rework feature, slightly stronger adhesion. The XK-D series is excellent at its adhesion replacing screw fixation. The bonding strength is greater than 3.7 Mpa.
2. Thermal conductivity design for application: irreplaceable combination of multiple characteristics
▪ XK-S series thermal gap filler is used in automotive power batteries, automotive electronics, communications, computers and other related equipment, heating parts and heat dissipation plate. The application principle is the same as XK-P series of thermal gap pad, so they can be exchanged except for different assembly methods.
▪ XK-D series has strong adhesion, could be an alternative, instead of the parts used for fixing, such as applying to power batteries' design, which the cell energy density high than 300Wh/kg.
Neither the gap filler XK-S series nor the gap pad XK-P series can replace this multi-characteristic thermal conductive structural adhesive.
In conclusion, the choice of Thermally Conductive Adhesives or Thermal Gap Filler, focuses on the thermal design of customers. It is necessary to integrate adhesion, sealing and insulation, that must be a XK-D series. The maximum gap filling is required to replace the gap pad assembly process, the XK-S series is the best choice.
GLPOLY, a special brand of thermal interface materials from China, with advanced technology and excellent production capability.
