Thermal management of 5G/6G has always been a challenge to thermal management engineers. What kind of thermal interface materials should be used? There is no affirmative answer. Thermal management materials suppliers worldwide invested huge amount of resources to research and develop thermal interface materials and thermal solutions, but a just a few of them made great achievements, GLPOLY was one of them.

Last June, a customer from Shanghai contacted me and enquired about thermal interface materials for 5G telecom station, requesting a high thermal conductivity of 6.0W/mK at least. We had two options--thermal gap pad and thermal gel/putty. But the bondline thickness of this application is just about 0.1mm, we had to remove option of thermal gap pad due to it’s thicker bondline thickness. So thermal gel is the only option.

I recommended a thermal gel with a thermal conductivity of 7.0W/mK according to the power of devices. This customer asked for samples for testing after he went through technical data sheet, “it seemed like data may satisfy my desgin requirement”he said.

Samples were delivered in three days. There were three samples would be tested including Chomerics THERM-A-GAP GEL60. This test lasted for two months, in the entire test process, temperature rise of device in which GLPOLY thermal gel XK-G70 was used was 15 centigrade lower than that of other devices. GLPOLY emerged as the best one and won the bidding.

GLPOLY thermal gel XK-G70 is a high thermal performance, low thermal resistance gap filling material, desgined for powerful devices heat transfer, accommodating a variety of gap thickness. It deflects under low compressive forces, decreasing stress on component thus decreasing component failure. This material is compatible with volume production, automated dispensing process in one-component package.

GLPOLY thermal interface materials has been applied to DT mobile, Freetech Auto Pilot, dJI smart driving system and Han’s Laser. GLPOLY serves top ten clients in their industries.