5G brings high efficiency, at the meantime it requires a more efficient thermal management solution due to great deal of heat that generated by huge amount of data exchange. GLPOLY has developed a non-curing, non-drip off high performance thermal gel / thermal putty XK-G70 to solve thermal management problems for 5G telecommunication equipment, beating competitive products in China.

Heat transfer of 5G telecommunication equipment is a great challenge to thermal gap pad. Comparing with thermal gap filler pad, no matter the thermal resistance, bondline thickness and assembly process, thermal gel / thermal putty provides superior advantages in the limited package. Thermal gel / thermal putty tends to be one of the best thermal management solutions.

GLPOLY XK-G70 thermal gel / thermal putty has following superiorities:     1.Thermal conductivity 7.0W/mK, ultra low thermal resistance, bondline thicnkness 0.15mm improve heat transfer;

2.Compatible with high volume, automated dispense process;

3.Aging test at 150 centigrade for 1200hrs; high and low temperature thermal shock for 500 cycles from-40 to 150 centigrade;

GLPOLY has introduced automated production lines for XK-G70 thermal putty / thermal gel production to keep consistancy of product. GLPOLY thermal putty has been applied to automotive electronic control unit, drone and consumer electronics in volume production.

GLPOLY thermal interface materials provide you with superior design flexibility.