Faster, more intelligent and efficient devices and solutions that result from 5G telecom, at the meantime, huge amount of heat will be generated by data exchange of 5G, as a result, a efficient thermal management solution is required. For solving 5G telecom equipment thermal management problem, GLPOLY developed a high performance thermal gel XK-G70 to improve heat transfer. There is no competitive products in China yet.

GLPOLY thermal putty is compatible with automated dispense process, eliminating time consuming hand assembly, improving heat transfer in limited space of devices. Due to 5G development, there is a huge demand for thermal gel. You will find different brands of thermal gel with different quality, so a superior and reliable thermal putty is vital to your application.

What are the advantages of XK-G70 thermal putty?

1. Thermal conductivity 7.0W/mK is a key index that can not be achieved by domestic competitors;

2. Compatible with automated dispense process, improving dispense precision and efficiency;

3. Accommodates a variety of bond line thickness;

4. Reliability verified by high temperature aging and thermal shock

GLPOLY thermal gel XK-G70 is a high performance, non-curing gap filling material, designed to eliminate time consuming hand assembly and increase assembly efficiency. It deflects under low compressive forces, decreasing stress on component thus decreasing component failure. 15 days of lead time of GLPOLY thermal putty decreases purchasing and logistics complexity. GLPOLY XK-G70 has been applying to dJI drone, DT Mobile Telecom equipment, and Freetech auto pilot already.

GLPOLY provides superior thermal interface materials for customers, keeping their devices run cooler and more reliably.