There are many factors which can affect the thermal performance of thermal interface materials, such as thermal conductivity, thermal resistance, thermal impedance, thermal contact resistance, thickness, state of product, this is an esteric sophisticated academic issue. As we knew, paste thermal interface materials provided more excellent thermal performance than solid ones. Let’s take GLPOLY XK-G50 thermal gel as an example.

GLPOLY XK-G50 is a high performance, one part packaged, non-curing thermal putty with a thermal conductivity of 5.0W/mK. It provides an ultra low thermal resistance and thin bondline thickness, which can make heat transfer rapidly.

Freetech, one of our customers, engaged into auto pilot sector. The chief engineer contact me and consulted with me about a high performance thermal interface material. He said he used a high thermal conductivity thermal gap pad, but he was not satisfy with test result, it seemed like the real performnace was inconsistent with what claimed on data sheet. I learned that the thermal conductivity of thermal gap pad he used was 5.0W/mK, actually, it suited most of electronics. I thought I figured out what the problem was. I said to customer:”Why not try thermal putty, it will give you surprise. 5.0W/mK thermal gel performs better than 5.0W/mK thermal gap pad due to extremely low thermal resistance.” Customer worried about the applicability of thermal putty,”How about the service life of thermal putty? If it drys out, it will make the pilot system failed.”

I recommended XK-G50 thermal putty to customer,”XK-G50 thermal putty will not dry out and drip off, providing a 8-year service life. It will not pollute components and easy to maintain.”

Two months later, high temperature aging test was finished, then thermal performance verification was proceeded. When customer saw the test report, he told me he felt surprised. The change of thermal conductivity was less than 5% comparing data before and after high temperature aging test, and thermal resistance was 0.0001°Cin^2/W, it was just one eighteenth of the thermal gap pad he used before. He changed all the thermal solution, introducing 5.0W/mK thermal putty to replace 5.0W/mK thermal gap pad. Now we have been partnered with each other for five years, no complaint received yet.

GLPOLY thermal gel XK-G50 has been applying to auto pilot system, 5G telecom equipment, drone and laser in volume production already. This material is designed for automated production system to eliminate time consuming hand assembly. It deflects under low compressive forces, decreasing stress on component.

GLPOLY has collaborated with DT Mobile, Han’s Laser, DJI, GAC Motor, Leap Motor and NIO Automotive etc, providing superior thermal interface materials for them to protect their brand reputation for high performance and reliability.