GLPOLY XK-PN series of products are conformable, thermally conductive, non-silicone based gap filling material, which has been applied to medical equipment, artifical intelligence for years. It’s well recognized by customers for high performance reliability. GLPOLY non-silicone thermal pad has occupied the largest market share in China, this is true.
Comparing with silicone based thermal gap pad, there is no siloxane volatilized from non-silicone thermal pad, it is ideal for devices which contains optical components such as camera, LED lighting, laser etc. To eliminate the possibility of atomization, GLPOLY designs non-silicone thermal pad.
A high-end electronic manfacturer-CFMEE designed a thermal solution for detector of Lithography machine, requiring non-silicone thermal interface materials with high performance, reliability and long service life. GLPOLY XK-PN50 non-silicone thermal pad had been validated in applications of medical equipment, AI devices several years before. When customer reviewed the test report, he was really satisfy with the characteristics: thermal conductivity 5.1W/mK, dielectric strength 10kV/mm, flammability UL94 V-0, Zero siloxane. GLPOLY XK-PN50 has been introduced into supplier system, waiting for volume production in three months.
How can GLPOLY non-silicone thermal pad attract customers’ attention?
1. Provides equivalent performance to top class brands, and 70% of its price;
2. Compliant with IATF16949 quality management system;
3. Automated production system, eliminate human error, and keep consistency of products.
GLPOLY thermal interface materials have been applied to 5G telecommunication, consumer electronics, medical equipment, new energy electric vehicle battery pack, automotive electronics and more. Besides non-silicone thermal interface materials, GLPOLY provides thermal management materials including thermal gap pad, thermal gap filler, thermally conductive structural adhesives, thermal gel etc.
GLPOLY helps you solve toughest thermal management challenges with full portfolio of thermal interface materials and time-tested techonogical service.
