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GLPOLY Thermal Management
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11W/mK Thermal Gap Pad Designed To Improve Electronics Cooling

2021-4-19 17:47:07   |   Source:GLPOLY   |   Author:GLPOLY   |   Views:

We can say confidently that GLPOLY thermal gap pad XK-P110 is the most exceptional, highly reliable gap filling pad in China, with no competing products.. It’s a straight choice between imported products or GLPOLY’s.

Just like most of suppliers had done, GLPOLY has developed a range of thermal interface materials including thermal gap pad, thermal gel, thermal gap filler, thermally conductive structural adhesive and non-silicone thermal interface materials etc, concentrating on auto and 5G applications. All processes are monitored and compliant to IATA16949 quality management system.

Last September, a customer from Shanghai contacted me consulating about an alternative to Fujipoly XR-J. We learned from communication that customer laid stress on data consistency of two products, especially thermal conductivity. GLPOLY thermal gap pad XK-P110 is a high performance gap filling material with a thermal conductivity of 11.0W/mK, providing similar performance to Fujipoly XR-J, suiting customer’s requirements.

Customer told me that a reliability test would be performed for two months after receiving samples. After two months of waiting, customer called me and said XK-P110 was highly reliable, temperature rise was even lower than expected. An added attraction of XK-P110 thermal gap filler pad is its competitive price, as this customer said price of XK-P110 is just 70% of that of Fujipoly XR-J, but the performance and equivalent. He had introduced XK-P110 into supplier system, waiting for serial production. I haven’t received any complaint since I collaborated with this customer.

GLPOLY thermal gap pad has been applied in high end industrial control system, medical equipment, 5G telecom equipment and smart devices etc high performance equipments.

GLPOLY has partnered with LG, DJI, DT Mobile, GAC Motor, NIO Motor and more, providing them with excellent thermal solution and qaulity thermal interface materials to protect their brand reputation for performance and reliability.

 
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