Careful management of thermal interface is crucial to maintaining the reliability and extending the life cycle of electronic devices and equipments.

As technology advances, new electronics generation requires higher power in small packages, the challenges associated with thermal management become more intense. Sophisticated thermal solutions are required:

Higher thermal conductivity

Low thermal impedance

Greater compliance and conformability

High stability and reliability

Greater adhesion

Ease of handling, application and use

Longer service life

GLPOLY has been a provider of thermal materials for ten years and has a successful history of providing thermal interface materials expertise and commitment to developing new high performance products including thermal gap pad, thermal gap filler, thermal compound, thermal putty and more to meet the thermal challenges of system designers in the line of automotive electronics, telecommunications, computer, consumer electronics, military, power conversion and motor control and more.