GLPOLY The thermal putty gel XK-G50 is a high performance thermal management solution for electronics assembly, it is thermally conductive particle filled silicone gel with high conformability and thermally conductive properties.

XK-G50 is formulated to accommodate today’s high performance electronics requirements and designed to transfer a high degree of heat away from hot components to heat sink.

It is a fully cured, no pump out, auto dispensable thermal interface material designed to replace conventional thermal conductive gap filler or pad. Simply dispense thermal putty onto component, assemble heat sink over it, and the product is ready to go. It is ideal for rework and maintainment situation.

This thermal putty does not require mixing and cure cycle, auto-dispensing process can reduce the assembly time and cost, which make the design more flexible.

With ultra soft properties, this thermal gel can easily deflect under very low compression force and will fill voids and uneven surfaces, accommodating a variety of bond line thickness. Thermal putty XK-G50 will also wet out matting surfaces in order to efficiently transfer heat from components to the heat sink.

Thermal putty XK-G50 can be stored at room temperature without any filler settling issues and is supplied in one-part.