GLPOLY XK-S20 is a two-part, high performance, thermally conductive liquid gap filling material, which features superior slump resistance and high shear thinning characteristics for optimized consistency and control during dispensing.

The mixed system will cure at room temperature and it also can be accelerated with addition of heat. Unlike cured thermal pad materials, a liquid approach offers infinite thickness variation with little or no stress to the sensitive components during assembly.

XK-S20 exhibits low level natural tack characteristics and is intended to use in applications where a strong structural bond  is not required. As cured, two-part thermal gap filler pad provides a soft, thermally conductive, form-in-place elastomer that is ideal for fragile assemblies and filling unique and intricate air voids and gaps.

Two part dispensable thermal gap filler pad is supplied in cartridge and used for automotive electronics, computer and peripherals, telecommunications and between any heat generating semiconductor and a heat sink.

Now, there are more and more designers consider it as battery pack thermal gap filler, it is suitable for automatic dispensing, improving productivity and reducing cost. The liquid material fills small gap and expells air under low pressure, optimizing thermal performance. When the part need to be maintained, thermal material can be easily removed and no containment or pieces left.