Thermal Gel
Silicone thermal grease was the main thermal solution for CPU in last several decades, high performance, low thermal resistance, ultrathin bondline thikcness are the oustanding features which outperforms common thermal pads. But now more and more thermal engineer does not like to utilize silicone thermal grease in their applications. Why does such a high performance thermal interface material be abandoned?
There are several reasons. Firstly, the silicone thermal grease will be pumped out and drip off when we apply some pressure, Secondly, it drys out and volatilizes in high temperature operation, volatiles will affect performance and service life of products. Thirdly, when we want to replace it with new material, it’s not easy to clean up because lots of silicone oil.
What kind of thermal interface material can be alternative to silicone thermal grease? GLPOLY had desgined a thermal gel XK-G30 with thermal conductivity of 3.0W/mK,it is a new thermal solution for thermal management, syringe packed, suitable for automated production system, thermal gel XK-G30 is desgined to eliminate time consuming hand assembly, decreasing installation, cost and reducing customer manufacturing and purchasing complexity. It requires no mixing or curing, providing superior design flexibility.
Thermal gel can be infinitely compressed and offer an bondline thickness of 0.09mm, thermal resistance is 0.00012℃in2/W., the most important is that thermal gel never dry out and drip off, it is ideal for delicate conponents with low stress.
