GLPOLY silicone free thermal gap filler pad is designed to counter FJ NR-c non-silicone thermal pad. With the features of no silicone oil leakage, no siloxane volatiles, no pollution to product and high reliability, it will become more and more popular in electronic application.

We make a comparison between GLPOLY thermal gap filler pad and FJ NR-c thermal pad, showing what advantages GLPOLY thermal gap pad has:

GLPOLY thermal gap filler pad has low hardness than FJ NR-c, it offers better thermal conductivity and conformability, keeping the thermal gap filler pad close contact with heat sink.

Aimed at the trend of lightweight, GLPOLY designs thermal gap pad in a low density, it is lower than FJ NR-c.

GLPOLY silicone free thermal gap filler pad provides excellent electrical feature also, the dielectric voltage up to 10KV, offering good reliability to products.

Comparison data shows that there are no distinctive technique differences between GLPOLY thermal gap filler pad and  FJ NR-c. GLPOLY thermal gap filler can perfectly replace FJ NR-c thermal gap pad.