The power consumption of 5G is four times than that of 4G, it is reported. A large amount of heat will be generated by high powersemiconductor, how do we select  thermal interface material for thermal management?

In 4G, a thermal gel with thermal conductivity of 3.0W/mK is good enough for telecommunications such as base station, mobile phone, computer and power supply, GLPOLY XK-G30 can be used for solving thermal issue for above devices.

But now, 5G is coming, we need to develop better performance thermal interface materials. GLPOLY launched 5.0W/mK, 6.0W/mK and 8.0W/mK thermal gel and 11.0W/mK thermal gap pad, maybe other manufacturers produced higher performance thermal pad, such as 13.0W/mK, 15W/mK, whatever. Comparing to thermal gap pad, GLPOLY thermal gel provides much better thermal performance even if it has lower thermal conductivity.  Why?

Let’s check it out. Firstly, the thermal resistance of thermal gel is extremely low, 0.001℃in^2/W, maybe one tenth thermal resistance of a thermal gap pad. Secondly, the bondline thickness could be 0.1mm, making heat transferring rapidly. Thirdly, thermal gel is ultra conformable with low forces, expelling air and filling gaps.

Further more, thermal gel is syringe packaging and suitable for automated production, eliminating time consuming hand assembly, reducing purchase and logistics complexity. It requires no curing, providing superior design flexibility.