THERMAL GAP PAD, THERMAL GAP FILLER, THERMAL MANAGEMENT SOLUTION

Many customers gave us a master parameters for cpmparing when they wanted to select a thermal gap pad from GLPOLY, all requirements should be similar. For example, the original data sheet marked”fiberglass or PI reinforced”, they need a fiberglass reinforced material too, even they don’t know what function or effect it acts.

Firstly, the fiberglass or PI will increase thermal resistance. Both of them will not act as thermal interface materials, reducing thermal performance.

Secondly, cost rise. If you need a same thermal conductivity after fiberglass or PI reinforced, we need to use a higher performance material, costs will rise by 30%. At the meantime, the cost of process will be inceased too, because it’s more sophisticated. Also don’t forget the cost of fiberglass or PI.

Last week, one solar equipment manufacturer contacted me and ask if we can make a thermal gap pad meeting his requirements. Actually, it just was a regular product, 2.0W/mK of thermal conductivity, Shore00 50 hardness, 4.0mm thickness, one sided fiberglass reinforced. I asked the cutomer why he request fiberglass reinforcement because it affects heat transfer greatly.

The custmer get this data sheet from another supplier, said “it increases tear resistance for easy assembly”. I understand customer’s concerns, but according to our experience, a thermal silicone pad with Shore00 50 hardness and 4.0mm thickness provides enough tensile strength and tear resistance for assembly. Finally, we sent samples without reinforcement to customer, and test went well.

We will recommend a better solution for you and keeping your devices performing steady.