Fujipoly is one of the most famous thermal interface materials manufacturers worldwide, so many thermal management engineers have some reasons to select Fujipoly thermal materials, such as high performance, highly conformable or high reliability.

Is it real that domestic products don’t work quite as well? I don’t think so. Taking Fujipoly products as benchmark, GLPOLY has been investing a lot of sources to develop high performance thermal management and made a lot of achievements also.

For example, GLPOLY thermal gap pad XK-P80-PUTTY is a high performance gap filling material which provides similar performance to Fujipoly PG80A. One customer wanted to find a high performance thermal gap pad in local market which must be alternative to Fujipoly PG80A. The customer asked for samples from five domestic  suppliers, none of them met the requirements.

We learned that the biggest problem is hardness and compression. As everyone knew,  the higher thermal conductivity, the harder the thermal pad, because we need to fill more thermally conductive powder into resin. The customer designed a 0.3mm gap which filled by a 1.5 mm thick thermal pad, that means a compression rate of 80% is needed. This is the biggest advantage of Fujipoly PG80A.

We recommended XK-P80-PUTTY to customer and sent them a sample for testing. One day later, the customer fed back,”I was surpprised, your sample exhibited similar technical data to Fujipoly PG80A, thermal conductivity is 8.0W/mK and compression rate is up to 80%, it perfectly substitutes for PG80A, I will recommend your product to our team.”

GLPOLY thermal gap pad XK-P80-PUTTY is high thermal performance, high compression gap filling pad. This material features high thermal conductivity and low thermal impedance, providing effective heat transfer from heat source to heatsink and helps keep your devices cool and performing at their best.