As a thermal management materials supplier, we often received questions from customer. For example, What’s the difference between silicone and silicone-free based thermal materials? Which material provides better performance, thermal pad or liquid thermal materials? Do liquid thermal material and thermal gap provide same performance with the same thermal conductivity? Take GLPOLY XK-GN30 as an example to illustrate briefly.

Silicone-free thermal interface materials has no silicone content, it is ideal for silicone-sensitive applications which has a optical window, such as camera, LED lights, Automotive headlights, avoiding siloxane volatiles and preventing them from atomizing.

XK-GN30 is a high performance, thermally conductive, one-component packaged,  liquid gap filling material with a thermal conductivity of 3.0W/mK. as we know, liquid thermal material has a low thermal impedance. With the same thermal conductivity, XK-GN30 silicone-free thermal gel has a thermal resistance of 0.01℃in²/W, comparing with a 3.0W/mK thermal gap pad, thermal impedance of XK-GN30 non-silicone thermal gel is one twentieth of that of thermal gap pad.

GLPOLY XK-GN30 provides a ultra thin bondline thickness of 0.09mm, making heat transfer fast. Comparing with thermal gap pad, usually the thinnest thicnkess is 0.3mm.

XK-GN30 is suitable for filling the intricate gaps and voids, it deflects under low compressive forces improving interface contact. Thermal gap pad never fill gaps as complete as liquid thermal material    .   

GLPOLY XK-GN30 silicone-free thermal gel has been applied to industrial camera in volume production for 5 years, it provides high performance and reliability, helps keep your devices performing at their best and extending service life.