It becomes more and more important to control the heat for electronic components in smaller package will ensure stable running applications and longer lifetime of component. The basic principle of thermal interface materials is to remove the air between heat source and the heat sink, since air is a good insulator of heat transfer.

We develop and deliver advanced thermal interface materials that protect electronics performance, enhancing operation efficiency and reliability for our customers. We are a trusted partner to the leading top technology brands.

GLPOLY thermal pad and thermal gap filler are provides features of high thermal performance, low thermal resistance, soft and conformability. Compared with top class suppliers such as 3M, Bergquist or Fujipoly, GLPOLY will peformance well.

For example, let’s check the comparison between GLPOLY XK-P110 thermal pad and Fujipoly XR-M. Both are high performance thermal gap pad with 11.0W/mK of thermal conductivity, the thermal resistance is 0.1℃in2/W and 0.17℃in2/W respectively. We can see that GLPOLY thermal pad XK-P80 is as good as Fujipoly XR-M.

What follows is electrical property, volume resistivity is the key factor for electrical insulation. GLPOLY XK-P110 thermal pad’s volume resistivity is 1.0x10¹³Ωcm, we can see that it’s 1x10¹¹Ωcm for Fujipoly XR-M gap filler pad. GLPOLY thermal pad XK-P110 provides higher reliability than Fujipoly XR-M thermal gap pad.

Most of thermal pads are based on similar raw materials like silicone oil and thermally conductivity filler, even the processes are the same. GLPOLY thermal pad XK-P110 provides the highest thermal conductivity comparing similar products in China and it is an perfect alternative to Fujipoly thermal gap filler XR-M, it can meet your requirements and make your devices perform stably.