GLPOLY is the first one that develops non-silicone thermal management materials, also it is the only that provides alternatives to 3M, Fujipoly, Laird non-silicone thermal interface materials.

In the last years, there was less demand for non-silicone thermal management materials, domestic suppliers didn’t want to invest resouces to develop non-silicone materials, you could see all of the products were imported with high price. GLPOLY has invested lot of resources to improve technologies on non-silicone thermal management materials since 2013. Now it is the largest supplier of non-silicone thermal interface materials in China local market.

Last year, an European customer contacted us consulted with us about thermal gap pad for mobile phone, providing a benchmark of 3M 5580H. 3m 5580H was arctylic based soft thermal gap pad with a thermal conductivity of 3.0W/mK and a hardness of Shore00 30. But because cost control effort needs a more cost-effective solution, they wanted to find a substitute in China.

After reviewing data sheet of 3M 5580H, I recommended XK-PN30 non-silicone thermal gap pad. This product provided similar performance to 3M 5580H except one discrepancy—hardness. GLPOLY XK-PN30 provided a hardness of Shore00 40, it’s a little harder than 3M 5580H. But according to our experience, Shore00 40 would help the assembly process. Customer recognized that this issue existed because thermal pad was too soft. He wished to compare by testing.

Half a month later, customer came back to me and said XK-PN30 is much convenient than 3M 5580H for workers to assemble, reducing wastage and increasing assembly effeciency. No complaint was fed back since we had partnered.

GLPOLY non-silicone thermal gap pad has been applied to products of dJI, Huawei Marine etc., performance and reliability had been validated in the last several years, without siloxane volatile issues and service life concerns.

GLPOLY provides most complete portfolio of thermal management materials for you to design tomorrow’s breakthroughs.