GLPOLY tends to be at the cutting edge of non-silicone thermal pad, but lots of people just know that only a few manufacturers can supply non-silicone thermal gap pad such as 3M, Bergquist or Fujipoly. What they don’t know is GLPOLY developed non-silicone(silicone free) thermal pad at the day established. GLPOLY is prefessional in development and manufacture of non-silicone thermal pad. We’ll compare GLPOLY silicone free thermal pad XK-PN30 with 3M 5500H non-silicone thermal gap pad for instance.

Generally, we determine performance of thermal gap pad by thermal conductivity and thermal resistance. 3M 5500H’s thermal conductivity and thermal resistance values as 3.0W/mK and 0.83℃in2/W. The thermal conductivity was tested according to its own standard, if tested by general standard ASTM 5470, 3M 5500H’s thermal conductivity is only 2.0W/mK. At the meantime, 0.83℃in2/W of thermal resistance is a little higher, from a professional perspective.

Now let’s check GLPOLY XK-PN30. Thermal conductivity is 3.0W/mK, test method is ASTM D5470 which is recognized by thermal management engineers and thermal materials manufacturers. What most significant is GLPOLY non-silicone thermal pad XK-PN30 featured a low thermal resistance 0.2℃in2/W, it’s just one fourth the value of 3M 5500H. Obviously, GLPOLY XK-PN30 provides better performance than 3M 5500H.

There is another parameter which affects thermal performance, it’s hardness.GLPOLY  XK-PN30’s hardness is Shore00 50, it’s low than that of 3M 5500H. We can compress XK-PN30 with a lower forces avoiding damage to PCB or other component.

For more details, please contact GLPOLY, you will find a better non-silicone thermal pad and make your device operate at its best.