GLPOLY thermal putty pad is a performance grade8.0W/mK gap filling material gap filling material with extremly high compression.  GLPOLY’s unique filled silicone matrix results in an innovative thermal product that when compared to other performance grade thermal materials, exhibits superior pressure versus deflection characteristics.  All of this is accomplished with a product that exceeds 8.0W/mK in thermal conductivity. The overall results is a lower total thermal resistance, without undue stress on your components.

Compared with Tflex HD90000 with a 7.5W/mK of thermal conductivity, GLPOLY thermal putty pad XK-P80-PUTTY provides a better performance because of higher thermal conductivity up to 8.0W/mK. At the mean time, GLPOLY thermal putty pad provides a low thermal resistance in 0.1℃in2/W, it is much lower than Laird Tflex HD90000 which shows a 0.19℃in2/W of thermal resistance.

In conclusion, GLPOLY XK-P80-Putty provides a higher performance than Laird Tflex HD90000.

GLPOLY XK-P80-Putty thermal gap pad is suitable for fragile components where low force is required, the low hardness featuring vibration dampening, protecting component from shocking. 

When appropriately integrated into a system, high deflection thermal gap pad will result in lower stress on component, optimizing thermal contact.

If you want to find a high performance thermal pad but short lead time is required, please contact GLPOLY, we will deliver samples or products in 7days. GLPOLY has partnered with dJI, DT mobile, NIO Auto, GAC NE and LG etc., thermal interface materials have been applied to smartphone, drone, automotive electronics, auto pilot system.