I’d received some enquiries from engineers of carmakers about cure schedule of GLPOLY thermally conductive adhesive XK-D20 series. To be honest, cure time is a critical issue for both engineers and suppliers. To engineers, it is directly related to production processes; to suppliers, cure time adjustment is related to change of properties of thermally conductive adhesive. So we need to find a balance between these two issues. GLPOLY is always at the leading edge of thermal interface materials development, it has provided a series of plans of cure time according to mainstream of processes in assembly site.

One of our customers contacted me and wanted to short the cure time after he had tried XK-D20 thermally conductive adhesive. He said he wanted to know the change of critical properties if thermally conductive adhesive cured by 90% in 15mins at 90 centigrade, so he can fix a a proper assembly process.

XK-D20 series provide three cure schedules including L(fast), M(medium) and H(slow). If the cure time of 90% cured is less than three hours at any temperature, the mechanical property will be changed, leading to a low elongation at break. If this issue was not concerned, L, M and H types could satisfy customer’s cure requirement, and the suggested temperature of L type is 100-125 centigrade. (under condition of measured cure schedule of 10min at 160 centigrade, shear bonding strength and thermal properties of thermally conductive adhesive are comply with specification).

From the view of integrated performance and cost performance, we suggest a 10% cured schedule (t10 means 10% cured, providing 0.5-1.0MPa shear bonding strength) instead of 90% cured (t90 means 90% cured, providing 5-9MPa shear bonding strength) for process, saving half the time.

Of course, the processes are diversified in different carmakers, we will provide professional suggestion according to actual applications. More details or questions please contact GLPOLY, we’ll get to you with superior service.

GLPOLY helps you design devices with superior thermal interface materials that run reliably and stably.