GLPOLY provides technical support for customer for FPGA thermal management.

GLPOLY is committed to solving thermal management problems, providing not only high performance thermal interface materials, but also technical consultance and support.

Many competitors provided several type of products when customer asked for samples. Why? Because they never helped customers verify practicability, but left the problems to customers themselves. GLPOLY never do business like this. We will study customers’ idea and desgin, simulating actual application status and verify the performance.

I received enquiry about medical equipment thermal management, applicationn temperature is about 50 degree celsius, PCB will be packaged in a sealed steel chamber. The heat that generated by PCB in chamber will be transfer from water cooling plate to air. PCB interface was irregular topography, the difference in height was 1.5mm, and gap between the highest point and cooling plate is 0.8mm. Customer wanted to use an appropriate (lowest) thermal conductivity thermal interface materials with low hardness for reducing cost. They designed a 1.5-2.0W/mK thermal interface material to application and wanted us to verify the practicability for them.

We calculated the data according the power, area etc, then we recommended a 1.5W/mK thermal gap pad to customer. We simulated the application environment and test the PCB. Two weeks later, we got the data, it was really close to our calculation-2.0W/mK was enough for this application.

So I sent several samples to customer for assembly and testing. One month later, customer told me our solution was good, trial production will be proceeded in next month.

GLPOLY thermal interface materials have been applying to 5G telecom equipment, automotive electronics, new energy vehicle battery pack, drone, smartphone and more. GLPOLY will provide technological advanced thermal solution for you to keep your devices run reliably.